Workshop: WMON1

"New Trends in Technology and Design Methodology for Highly Integrated MMICs and Systems on Chip"

Monday 8 Jan., 2007
8:30 AM- 5:00 PM
     
Abstract:
The high levels of integration of MMIC and SoC technology represent an evolution in the world of wireless.  The desired integration includes analog and digital control circuits, radio frequency circuits operating from handset frequencies through millimeter-wave frequencies, and high-speed digital signal processing and clocking at operating frequencies up to tens of GHz. The rapid growth of semiconductor technologies will support developments of very highly integrated RF circuit functions on a chip combined with additional functions of a digital and/or an analog nature, but, to date, the majority of the research effort is being done without considering the adequacy of the circuit methodology/technology applied to the various frequencies and applications within the chip. The challenges involved to optimally accomplish these integration objectives are quite complex and involve questions like: What are or should be integrated on a chip? What are the solutions for different frequency bands? How to solve the electromagnetic interference issues caused by the mixing of signals? How to implement tests for these varied functions?

The workshop objective is to bring together experts from different areas to survey the current methodologies/technologies for high MMIC integration and SoC, to discuss advantages and disadvantages, and to assist the participants in gaining a coherent overview on the challenges present and future issues. Though the SoC level integration is pursued, the SiP is an alternative or competing technology for system level integration. Hence, a SiP issue is included in this workshop.

Organizers:

Dr Tsuneo Tokumitsu
Eudyna Devices Inc., Yamanashi, Japan

Dr Edmar Camargo
WJ Communications, San Jose, CA

Speakers:

• Mr. Fred Schindler, RFMD
  "Overview “SoC – Sensible or Crazy?”"

• Dr. Noriharu Suematsu, Mitsubishi Electric
  "PA, T/R Switch Integration on Single Si Transceiver IC"

• Michiel Steyaert and Patrick Reynaer, K. U. Leuven ESAT-MICAS
  "Fully Integrated CMOS RF Transceivers and Power Amplifiers: Dream, Nightmare or … Reality?"

• Dr. Huei Wang, National Taiwan University
  "MMICs for System on Chip (SoC)"

• Dr. Kenjiro Nishikawa, NTT
  " Three-Dimensional MMIC Technology for Highly-Integrated GaAs- and Si-MMICs; A Challenge for Microwave and Millimeter-Wave System-on-Chip"

• Dr. Walter De Raedt, IMEC
  "RF SiP: A Challenge and an Opportunity for Microwave Circuit and System Integration"

• Osama Shanna, Maxim
  "Challenges and Design Considerations for Robust High-Sensitivity SoC Radio Transceivers"

• Nobuyuki Itoh, Toshiba
  "Realization of Wireless SoC and Beyond It ~Reconfigurable Wireless SoC"