IEEE Radio and Wireless Conference
RAWCON 2004
Sunday Workshop - WM3
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Advances
in RF and High-Speed System Integration
Monday, September 20,
2004
8:00 AM – 12:00 PM
Organizers:
Joy Laskar, Kyutae
Lim, and Sudipto Chakraborty,
Georgia Institute of Technology
Speakers:
- Modest M. Oprysko, IBM
Building Millimeter Wave Circuits in Silicon
- Udy A. Srivastava, Intel
High Density Integration of RF Products and Packaging Challenges
in Gigabit Mixed Signal Systems
- Chang-Ho Lee, Georgia Institute of
Technology
Low-Power Radio Design and Packaging for Microsensor Applications
- Manos Tantzeris, Georgia Institute
of Technology
RF/Wireless Packaging and 3D Integration: Status and Challenges
- Kevin Oh, Skyworks
Challenges and Development of Power Amplifier Module
Abstract:
This workshop focuses on advanced circuits and packaging
technologies for high data rate mixed signal communication
front-ends. The subtopics include development of milimeterwave
integrated circuits in silicon, packaging technologies for
densely integrated mixed signal products, circuits/systems
codesign for front-end communication modules, vertical integration
aspects of the integrated module for small form factor implementation,
along with the development of power amplifier module. This
workshop covers all aspects of advanced developments on circuits
and systems for mixed signal systems. |
