Sunday Workshop - WM3

Advances in RF and High-Speed System Integration
Monday, September 20, 2004
8:00 AM – 12:00 PM

Organizers:

Joy Laskar, Kyutae Lim, and Sudipto Chakraborty,
Georgia Institute of Technology

Speakers:

• Modest M. Oprysko, IBM
  Building Millimeter Wave Circuits in Silicon
• Udy A. Srivastava, Intel
  High Density Integration of RF Products and Packaging Challenges in Gigabit Mixed Signal Systems
• Chang-Ho Lee, Georgia Institute of Technology
  Low-Power Radio Design and Packaging for Microsensor Applications
• Manos Tantzeris, Georgia Institute of Technology
  RF/Wireless Packaging and 3D Integration: Status and Challenges
• Kevin Oh, Skyworks
  Challenges and Development of Power Amplifier Module

Abstract:

This workshop focuses on advanced circuits and packaging technologies for high data rate mixed signal communication front-ends. The subtopics include development of milimeterwave integrated circuits in silicon, packaging technologies for densely integrated mixed signal products, circuits/systems codesign for front-end communication modules, vertical integration aspects of the integrated module for small form factor implementation, along with the development of power amplifier module. This workshop covers all aspects of advanced developments on circuits and systems for mixed signal systems.